Signal Integrity

Power-aware Signal Integrity and EMI/EMC On High-speed Digital Chip-to-Chip Links

Signal Integrity header image 2

Fast-Approaching Deadlines for DesignCon and MTT

Posted July 28th, 2008 · Please leave a comment · Conference

Share

DesignCon 2009, Santa Clara, CA, February 2-5, 2009

Submission deadlines for:

IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium 2009 (IMS 2009), Boston, MA, June 7-12, 2009, “Microwave Week”

The Microwave System Focus Technical Area will include a section “Signal Processing Circuits and Systems at GHz Speeds.” Topics in this section will include:

  • High-speed mixed-signal components, modules and subsystems;
  • ADC, DAC, and DDS;
  • backplanes, signal integrity and equalization;
  • electrical/optical interfaces and transmission;
  • MIMO; SDR and cognitive systems.

Submission deadlines for:

There goes summer relaxation!

Tags: ······

Please leave the first comment so far ↓

Please leave the first comment.

Leave a Comment