Signal Integrity

Power-aware Signal Integrity and EMI/EMC On High-speed Digital Chip-to-Chip Links

Signal Integrity header image 2

Visit the Agilent at Electrical Performance of Electronic Packaging

Posted October 3rd, 2008 · Please leave a comment · Conference


The 17th IEEE Conference on Electrical Performance of Electronic Packaging (EPEP 2008) will be held October 27-29, 2008, in Wyndham Hotel, San Jose, California. The 2007 meeting attracted a large number of professionals to what is now widely recognized as the premier technical meeting on electrical considerations in packaging.

Sponsors are IEEE Microwave Theory and Techniques Society (MTT-S) and IEEE Components, Packaging and Manufacturing Technology Society (CPMT-S).

Agilent EEsof EDA is exhibiting at this event. Registration for the exhibit alone is free.

Exhibit hours are:
9am – 7pm Monday, October 27
8am – 2pm Tuesday, October 28
Hope to see you there!

Tags: ····

Please leave the first comment so far ↓

Please leave the first comment.

Leave a Comment