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Practical Analysis Of Backplane Vias

Posted April 2nd, 2009 · Please leave a comment · Application Note

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RF Global Net are offering a download of the white paper that my Agilent colleagues Sanjeev Gupta and Mike Resso co-wrote with Eric Bogatin and Lambert Simonovich.

Here are the details:

Practical Analysis Of Backplane Vias

By Dr. Eric Bogatin of Bogatin Enterprises, Lambert Simonovich of Nortel, and Sanjeev Gupta and Mike Resso, of Agilent Technologies

In this paper, Dr. Bogatin and his co-authors show how accurate, verified models for vias in a multilayer circuit board are necessary to predict link performance in the multi-gigabit-per-second regime. It describes a method for using measurements on a test vehicle to build a high-bandwidth, scalable model of long vias, including the through- and stub-effects. This model can then be used in Agilent’s Advanced Design System for simulation. The methodology provides valuable insight into the root causes of performance limits and how to overcome them.

They are also are offering a download of an excellent white paper:

State Of The Art In EM Software For Microwave Engineers

…by my Agilent colleagues Jan Van Hese, Jeannick Sercu, Davy Pissoort, and Hee-Soo Lee.

Description:

The growing number and complexity of high frequency systems is leading to an increased need for electromagnetic (EM) simulation to accurately model larger portions of the system. There are several different technical approaches to EM simulation, and while no method is generally superior to the others, each one of them is aligned with one or more application areas. This article will discuss the three most established EM simulation technologies: method of moments (MoM), finite element method (FEM), and finite difference time domain (FDTD), linking the simulation technology to solving specific applications.

Both are free with registration

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