Signal Integrity

Power-aware Signal Integrity and EMI/EMC On High-speed Digital Chip-to-Chip Links

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Paper Includes Primer on Maxwell’s Equations

Posted June 15th, 2010 · Please leave a comment · Seminar

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The star of the show is the new 32GHz ‘scope, but we’re presenting an EEsof paper as part of a series of free Agilent SI seminars in Europe, details below. Hope to see you there, but if you can’t get to one of the live events, an on-demand webcast version is posted here Measuring Without Placing a Probe and Measuring Things That Haven’t Been Built Yet. It includes a refresher on Maxwell’s equations and field solvers that I’m hoping will give you an ‘A ha!’ moment or two. There’s also a PDF version of the slides with a transcript in the notes section here: PDF of Measuring Without Placing a Probe and Measuring Things That Haven’t Been Built Yet.

Registration pages by country for Signal Integrity Seminar
21 June München Germany
22 June Böblingen Germany
23 June Massy France
24 June Winnersh UK
Agenda (typical: check local listing)
0900-0915 Registration
0915-0930 Welcome
0930-1030 Signal Integrity Basics and Measurement Solutions
Abstract
There are 3 trends that impact every digital designer today:

  1. Higher data rates make more challenging designs and with that comes SI issues
  2. FPGAs offering high-speed I/Os, SERDES, and more capabilities making accurate system simulation more difficult
  3. New digital standards are introduced or evolve every 2 or 3 years with data rates doubling, problems usually quadruple

At fast edge rates electrical interconnects can cause distortions to the signals coming out of a driver. If there is an impedance mismatch between the PCB trace and the receiver a ringing is seen in the receiver. This ‘ringing’ can cause significant problems in the performance of the circuit. Signal Integrity Engineering is about quickly finding the cause of these problems and fixing them intelligently, hopefully before a physical prototype is built. Signal Integrity is all about paying attention to RF effects, which means impedance. Better anticipating these will provide a more robust design.

This presentation is a detailed technical tutorial on the different aspects of Signal Integrity, with examples of typical implementations.

1030-1045 Coffee break and product demonstrations
1045-1200 Embedding/De-embedding with a High-Speed Oscilloscope
Abstract
Characterizing digital systems with today’s high speed designs is challenging. The higher data rates cause measurement and observability problems because of microwave transmission effects: where we are connected is not where we REALLY where we want to measure, reflections cause uncertainties, and even the probes used to measure change the design to be analyzed. We commonly hear the word ‘de-embedding’ referring to the removal some of the unwanted artifacts arising from the high speed environment and ’embedding’ referring to adding effects, say of a cable, to view for instance, the effective eye that would be seen at a digital receiver. De-embedding and Embedding are similar mathematical functions in transforming time domain waveforms. This seminar will focus on the basic problems that are presented and a common method to address the growing need to measure and simulate simultaneously.

1200-1330 Lunch and product demonstrations
1330-1430 Measuring Without Placing a Probe and Measuring Things That Haven’t Been Built Yet
Abstract

The Infiniium real time scope with InfiniiSim de-embedding software allows you measure signals wherever you want, not just where you can place a probe easily. But to do this, you need the s-parameters between the probe and the point of interest. The s-parameters could come from measurement, but this reopens the problem of getting a probe on the point of interest. The first part of this paper shows how you can use 3D geometry, material properties, and electromagnetic simulation to create the de-embedding information even for points of interest that are inaccessible.

In the second part of the paper we’ll show how to explore the design space without the expensive and time consuming “cut and try” method of building and measuring many different prototypes. We’ll show how to use measured data from hardware that has been built and use simulation with EDA tools to quickly and cheaply determine the characteristics of candidates that haven’t been built yet.

1430-1445 Coffee break and product demonstrations
1445-1545 Use of the Network Analyser for Superior Signal Integrity measurement
Abstract

As bit rates of digital systems increase, signal integrity of interconnects drastically affects system performance. Fast and accurate analysis of interconnect performance in both time and frequency domains become critical to ensure reliable system performance. This workshop introduces a new time domain reflectometry (TDR) solution, the Agilent E5071C ENA Option TDR, which provides a one box solution for high speed interconnect analysis, including impedance, S-parameters, and eye diagrams. The ENA Option TDR provides the following three breakthroughs for signal integrity design and verification: Simple and Intuitive Operation, Fast and Accurate Measurements, and ESD Robustness. Concepts covered include: frequency domain TDR and time domain TDR theory, Comparison of measurement performance between Vector Network Analyzer and TDR Oscilloscope, and interconnect analysis/troubleshooting examples.

1545 – 1600 Q & A
1600 Close

Seminar in France

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