Signal Integrity

Power-aware Signal Integrity and EMI/EMC On High-speed Digital Chip-to-Chip Links

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DesignCon Community

Posted October 23rd, 2012 · Please leave a comment · Conference

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Posted by Colin Warwick

I’ve been checking out the new DesignCon Community web site, which is an extension of the DesignCon conference, and features year round conversations around signal integrity, high-speed interconnects, test-and-measurement methodologies, power integrity, PC-board design tools and methodologies, analog and mixed-signal design and verification, and FPGA-based design and application.

I encourage you to join the conversation, and prepare for your trip to DesignCon 2013! I hope you’ll enjoy it as much as I’m doing!

The DesignCon Community web site is sponsored by DesignCon folks (UBM) and Agilent.

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